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Publications by Hong-mei WANG
The Analysis of the Key Technologies of the Packaging Device Applied for the Epoxy Moulding Materials
DEStech Transactions on Materials Science and Engineering
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Effects of the Vacuum Moulding Process on the Mechanical Properties of Cotton/Epoxy Composite
Fibres and Textiles in Eastern Europe
Materials Science
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Packaging Technologies of Optical Circuits. Possibility of Polymers for Lightwave Guide Materials.
The Journal of Japan Institute for Interconnecting and Packaging Electronic Circuits
Microalgae Biopeptides Applied in Nanofibers for the Development of Active Packaging
Polimeros
Organic Chemistry
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Thermophysical Aspects of Reclaimed Moulding Sand Addition to the Epoxy-So2 Coremaking System Studied by Fourier Thermal Analysis
Journal of Thermal Analysis and Calorimetry
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Condensed Matter Physics
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Multiprocessor Modeling Technologies for the Applied Statistical Tasks
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Promising Technologies and Trend of Print Circuit Board for the Electronics Packaging
Journal of Japan Institute of Electronics Packaging
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The Full Impact of Advanced Materials Technologies
Advanced Materials Technologies
Mechanics of Materials
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Optimization of Compression Moulding Temperature for Polypropylene Materials
Materialpruefung/Materials Testing
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Finite-Key Analysis for Measurement-Device-Independent Quantum Key Distribution
Nature Communications
Astronomy
Genetics
Molecular Biology
Biochemistry
Chemistry
Physics
