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Publications by Hua-Kun Huang
Preparation of Novel xGNPs/SBS Composites With Enhanced Dielectric Constant and Thermal Conductivity
Advances in Polymer Technology
Organic Chemistry
Polymers
Plastics
Chemical Engineering
Related publications
Enhanced Thermal Conductivity of Polyimide Composites With Boron Nitride Nanosheets
Scientific Reports
Multidisciplinary
Enhanced Thermal Conductivity of Graphene Nanoplatelets Epoxy Composites
Materials Science-Poland
Mechanics of Materials
Materials Science
Condensed Matter Physics
Mechanical Engineering
Ternary Composites of Linear and Hyperbranched Polyimides With Nanoscale Silica for Low Dielectric Constant, High Transparency, and High Thermal Stability
RSC Advances
Chemistry
Chemical Engineering
Thermal Conductivity of Carbon Nanoreinforced Epoxy Composites
Journal of Nanomaterials
Materials Science
Nanotechnology
Nanoscience
Thermal Conductivity, Electrical Conductivity and Specific Heat of Copper-Carbon Fiber Composites
Transactions of the Japan Institute of Metals
Thermal Conductivity and Diffusivity of Carbon‐reinforced Polyetherketoneketone Composites
Journal of Applied Polymer Science
Surfaces
Plastics
Polymers
Materials Chemistry
Films
Coatings
Chemistry
Study of Dielectric and Thermal Conductivity Characteristics of Polyimide Composite
Materials Sciences and Applications
Designing and Preparation of Fiber-Reinforced Composites With Enhanced Interface Adhesion
Polymers
Polymers
Plastics
Chemistry
Research on the Thermal Conductivity and Dielectric Properties of AlN and BN Co-Filled Addition-Cure Liquid Silicone Rubber Composites
RSC Advances
Chemistry
Chemical Engineering
