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Publications by I Ping Wang
Relieving Sn Whisker Growth Driven by Oxidation on Cu Leadframe by Annealing and Reflowing Treatments
Journal of Applied Physics
Astronomy
Physics
Related publications
Structure and Kinetics of Sn Whisker Growth on Pb-Free Solder Finish
Effects of Microstructure of Deposited Sn Films and Orientation Index of Cu Foils on Sn Whisker Formation Using Substitutionally-Deposited Sn Films
Materials Transactions
Mechanics of Materials
Materials Science
Condensed Matter Physics
Mechanical Engineering
Pulverization of Molten Sn and Sn-Cu by a Bladed Rotator Method.
Transactions of the Iron and Steel Institute of Japan
Controlling Carboxyl Deprotonation on Cu(001) by Surface Sn Alloying
Journal of Physical Chemistry C
Surfaces
Energy
Nanoscience
Theoretical Chemistry
Optical
Magnetic Materials
Films
Nanotechnology
Electronic
Coatings
Physical
Cellulose Oxidation by Laccase-Tempo Treatments
Carbohydrate Polymers
Organic Chemistry
Polymers
Materials Chemistry
Plastics
Study on Sn–Ag Oxidation and Feasibility of Room Temperature Bonding of Sn–Ag–Cu Solder
Materials Transactions
Mechanics of Materials
Materials Science
Condensed Matter Physics
Mechanical Engineering
Physico-Mechanical and Tribological Properties of Fe-Cu-Ni-Sn and Fe-Cu-Ni-Sn-Vn Nanocomposites Obtained by Powder Metallurgy Methods
Tribology in Industry
Mechanics of Materials
Surfaces
Mechanical Engineering
Interfaces
Films
Coatings
Growth of Aluminium Nitride Whisker by Vapor Phase Reaction
NIPPON KAGAKU KAISHI
Recovery of CHC- And NBTI-induced Degradation on MOSFETs by Using Different Annealing Treatments
