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Publications by Ichiro KOIWA

Advanced Plating Technology for Electronic Devices

Electrochemistry
Electrochemistry
2006English

Effects of Additives and Dissolved Oxygen on Electroless Copper Deposition.

Journal of the Metal Finishing Society of Japan
1985English

Film Properties of Full-Additive Electroless Copper Deposits and Their Electrochemical Mixed Potential Monitoring

Circuit Technology
1987English

Analysis of Tarnished Copper Foil

Journal of The Surface Finishing Society of Japan
2008English

Aluminum Surface Modification for High Adhesion Between Insulation Resin and Aluminum

Journal of Japan Institute of Electronics Packaging
Electronic EngineeringElectrical
2007English

Electroless Nickel Plating on the Fine Pattern Using Mixed Plating Bath Containing Hydrazine and Hypophosphite

Journal of Japan Institute of Electronics Packaging
Electronic EngineeringElectrical
2007English

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