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Publications by Izhar Ahmed
Comparative Studies on Solder Joint Reliability of Plastic and Ceramic Ball Grid Array Packages of the Same Form Factor Under Power and Accelerated Thermal Cycling
Journal of Electronic Packaging, Transactions of the ASME
Mechanics of Materials
Electronic Engineering
Optical
Computer Science Applications
Electrical
Magnetic Materials
Electronic
Related publications
Routing of Monotonic Parallel and Orthogonal Netlists for Single-Layer Ball Grid Array Packages
IEICE Transactions on Fundamentals of Electronics, Communications and Computer Sciences
Electronic Engineering
Computer Graphics
Signal Processing
Applied Mathematics
Electrical
Computer-Aided Design
Fine Pitch and Low Temperature Bonding Using Solder Bumps and the Assessment of Solder Joint Reliability
Materials Transactions
Mechanics of Materials
Materials Science
Condensed Matter Physics
Mechanical Engineering
Thermal Performance Prediction of Plastics Ball Grid Array (Pbga) Using Artificial Neural Network
ASEAN Journal on Science and Technology for Development
MILP-Based Efficient Routing Method With Restricted Route Structure for 2-Layer Ball Grid Array Packages
IEICE Transactions on Fundamentals of Electronics, Communications and Computer Sciences
Electronic Engineering
Computer Graphics
Signal Processing
Applied Mathematics
Electrical
Computer-Aided Design
Effect of Electroless Ni-P / Electrolytic Cu Plating on Solder Joint Reliability Under High Temperature Environment of 200 ℃
Journal of The Surface Finishing Society of Japan
Effect of Multiple Reflows on the Mechanical Reliability of Solder Joint in LED Package
Journal of Korean Institute of Metals and Materials
Surfaces
Alloys
Metals
Simulation
Optical
Magnetic Materials
Films
Modeling
Coatings
Electronic
The Influence of Additives in Electroless Nickel Plating Film on the Reliability of Solder Joint
Journal of The Surface Finishing Society of Japan
Warpage Prediction of Ball Grid Array Package With the Homogenization Method
Journal of Japan Institute of Electronics Packaging
Electronic Engineering
Electrical
Thermal Cycling Simulation in Electronic Packages Using Molecular Dynamic Method
