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Publications by J. Andresen
Development of a High Density Pixel Multichip Module at Fermilab
IEEE Transactions on Advanced Packaging
Related publications
Multichip Module High Speed Testing
DFT and BIST of a Multichip Module for High-Energy Physics Experiments
IEEE Design & Test of Computers
Photovoltaic Retinal Prosthesis With High Pixel Density
Nature Photonics
Optics
Molecular Physics,
Optical
Atomic
Magnetic Materials
Electronic
Modeling and Analysis of Multichip Module Power Supply Planes
IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part B
Vertically Integrated Circuit Development at Fermilab for Detectors
Journal of Instrumentation
Instrumentation
Mathematical Physics
Low-Power Multichip Module and Board-Level Links for Data Transfer
Module and System Test Development for the Phase-2 ATLAS ITk Pixel Upgrade
Nuclear Instruments and Methods in Physics Research, Section A: Accelerators, Spectrometers, Detectors and Associated Equipment
High Energy Physics
Instrumentation
Nuclear
The Development of High Power LED Module
Journal of the Illuminating Engineering Institute of Japan (Shomei Gakkai Shi)
Electronic Engineering
Electrical
High-Speed Electrical Testing of Multichip Ceramic Modules
IBM Journal of Research and Development
Computer Science
