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Publications by J. Byron Mc Cormick
Development of Integrated Thermionic Circuits for High-Temperature Applications
IEEE Transactions on Industrial Electronics
Control
Systems Engineering
Computer Science Applications
Electrical
Electronic Engineering
Related publications
High-Temperature Vapor-Filled Thermionic Converter
Temperature Sensor for Monitoring of Hot Spots in Integrated Circuits
SPIE Newsroom
Development of High-Strength Niobium Alloys for Elevated-Temperature Applications
Distributed ESD Protection for High-Speed Integrated Circuits
IEEE Electron Device Letters
Electronic Engineering
Optical
Electrical
Magnetic Materials
Electronic
A Study on High Temperature CMOS Circuits for Sensor Applications With SDB-SOI Wafer.
IEEJ Transactions on Sensors and Micromachines
Electronic Engineering
Electrical
Mechanical Engineering
High-Frequency Distortion Analysis of Analog Integrated Circuits
IEEE Transactions on Circuits and Systems II: Analog and Digital Signal Processing
Materials for High Temperature Engineering Applications
Applied Mechanics Reviews
Mechanical Engineering
Development of a TEM-cell for Electromagnetic Compatibility Testing of Integrated Circuits
Proceedings of Tomsk State University of Control Systems and Radioelectronics
Organic–Inorganic Eu3+/Tb3+ Codoped Hybrid Films for Temperature Mapping in Integrated Circuits
Frontiers in Chemistry
Chemistry
