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Publications by J. Pstruś
The Role of Physico-Chemical Properties of Liquid Solder in Reactive Wetting: The Cu/SnZnIn System
Journal of Mining and Metallurgy, Section B: Metallurgy
Mechanics of Materials
Geotechnical Engineering
Alloys
Engineering Geology
Materials Chemistry
Metals
Related publications
The Role of Intermetallic Compounds in Controlling the Microstructural, Physical and Mechanical Properties of Cu-[Sn-Ag-Cu-Bi]-Cu Solder Joints
Scientific Reports
Multidisciplinary
Reactive Wetting of Ceramics by Liquid Metals
Materials Transactions, JIM
Wetting Properties, Recrystallization Phenomena and Interfacial Reactions Between Laser Treated Cu Substrate and SAC305 Solder
Applied Surface Science
Surfaces
Astronomy
Condensed Matter Physics
Interfaces
Films
Coatings
Chemistry
Physics
Wetting and Spreading in the CuAg System
Acta Metallurgica
Physico-Chemical Constraints Connected With the Coding Properties of the Genetic System
Journal of Theoretical Biology
Statistics
Genetics
Probability
Molecular Biology
Biochemistry
Applied Mathematics
Microbiology
Simulation
Immunology
Biological Sciences
Medicine
Agricultural
Modeling
Solidification and Wetting Behaviour of SnAgCu Solder Alloyed by Reactive Metal Organic Flux
Soldering and Surface Mount Technology
Electronic Engineering
Electrical
Condensed Matter Physics
Materials Science
The Physico-Chemical Properties of 2-Methoxyphenoxyacetates of Mn(II), Co(II), Ni(II) and Cu(II)
Eclética Química Journal
Reactive Wetting Behaviors of Sn/Cu Systems: A Molecular Dynamics Study
Nano-Micro Letters
Surfaces
Electronic Engineering
Nanoscience
Optical
Electrical
Magnetic Materials
Films
Nanotechnology
Electronic
Coatings
Physico-Chemical Properties of Squid Paramyosin.
Nippon Suisan Gakkaishi
Aquatic Science
