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Publications by J. Van Erps
Enhanced Pluggable Out-Of-Plane Coupling Components for Printed Circuit Board-Level Optical Interconnections
Related publications
Innovative Optical and Electronic Interconnect Printed Circuit Board Manufacturing Research
Ceramic Printed Circuit Board Material.
Circuit Technology
Group Set-Up for Printed Circuit Board Assembly
International Journal of Production Research
Industrial
Manufacturing Engineering
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Management Science
Management
Operations Research
A Printed Circuit Board Gradiometer Current Transformer
Board-Level Optical Interconnections Using a Plastic Optical Fiber Wiring Sheet Equipped With Right-Angle-Turn Connectors.
Journal of Japan Institute of Electronics Packaging
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Production Planning Problems in Printed Circuit Board Assembly
Discrete Applied Mathematics
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Discrete Mathematics
The Component Retrieval Problem in Printed Circuit Board Assembly
International Journal of Flexible Manufacturing Systems
Analysis of Weighted Fan-Out/Fan-in Volume Holographic Optical Interconnections
Applied Optics
Thermodynamic-Based Exergy Analysis of Precious Metal Recovery Out of Waste Printed Circuit Board Through Black Copper Smelting Process
Energies
Control
Electronic Engineering
Energy Engineering
Renewable Energy
Energy
Fuel Technology
Sustainability
Optimization
Electrical
Power Technology
the Environment
