Amanote Research
Register
Sign In
Discover open access scientific publications
Search, annotate, share and cite publications
Publications by J. W. Liang
Experiments and Simulation of Stress Induced Voiding Dependence on Upper Metal Cap Layer in Cu/Low K Interconnects
Related publications
Effects of Multi-Layer Graphene Capping on Cu Interconnects
Nanotechnology
Mechanics of Materials
Electronic Engineering
Mechanical Engineering
Materials Science
Nanoscience
Electrical
Bioengineering
Nanotechnology
Chemistry
Chip-Package Interaction and Crackstop Study for Cu∕Ultra Low-K Interconnects
Stress Migration Phenomena of Cu Interconnects
Effect of an Oxide Cap Layer and Fluorine Implantation on the Metal-Induced Lateral Crystallization of Amorphous Silicon
ECS Journal of Solid State Science and Technology
Optical
Electronic
Magnetic Materials
Low-K Dielectric- A Potential Solution for Crosstalk Induced Signal Integrity Issues in SWCNT Interconnects
IOSR journal of VLSI and Signal Processing
Relaxation of Thermal Stress by Dislocation Motion in Passivated Metal Interconnects
Journal of Materials Research
Mechanics of Materials
Materials Science
Condensed Matter Physics
Mechanical Engineering
A Study of Low-Frequency Noise on High-K/Metal Gate Stacks With in Situ SiOx Interfacial Layer
Electrical Reliability of Cu and Low- K Dielectric Integration
Materials Research Society Symposium - Proceedings
Mechanics of Materials
Materials Science
Condensed Matter Physics
Mechanical Engineering
Stretchable Wavy Metal Interconnects
Journal of Vacuum Science and Technology A: Vacuum, Surfaces and Films
Surfaces
Films
Interfaces
Condensed Matter Physics
Coatings
