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Publications by J. Y. Hsieh
Reactive Wetting Behaviors of Sn/Cu Systems: A Molecular Dynamics Study
Nano-Micro Letters
Surfaces
Electronic Engineering
Nanoscience
Optical
Electrical
Magnetic Materials
Films
Nanotechnology
Electronic
Coatings
Numerical Simulation of the Read Disturb Behavior on the ONO Scaling Margin in SONOS Flash Memory
Related publications
Dynamic Wetting on Moving Surfaces: A Molecular Dynamics Study
Molecular Dynamics of Soft Wetting
Reactive Molecular Dynamics Study of the Thermal Decomposition of Phenolic Resins
Journal of Composites Science
Strengthening of Nanosized BCC Cu Precipitate in BCC Fe: A Molecular Dynamics Study
Materials Transactions
Mechanics of Materials
Materials Science
Condensed Matter Physics
Mechanical Engineering
The Role of Physico-Chemical Properties of Liquid Solder in Reactive Wetting: The Cu/SnZnIn System
Journal of Mining and Metallurgy, Section B: Metallurgy
Mechanics of Materials
Geotechnical Engineering
Alloys
Engineering Geology
Materials Chemistry
Metals
Dynamics of Molecular Systems
European Physical Journal D
Optics
Atomic
Molecular Physics,
Kinetics of Reactive Diffusion in the (Sn–Cu)/Ni System at Solid-State Temperatures
Materials Transactions
Mechanics of Materials
Materials Science
Condensed Matter Physics
Mechanical Engineering
Molecular Dynamics Simulation of the Growth of Cu Nanoclusters From Cu Ions in a Plasma
Physical Review B
ELECTRODEPOSITION OF (Cu-Sn)1/(Cu-Sn)2 MULTILAYER COATINGS FROM PYROPHOSPHATE-TRILONATE ELECTROLYTE
Scientific notes of Taurida National V.I. Vernadsky University. Series: Technical Sciences
