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Publications by J.K.L. Lai
The Effect of Solder Paste Viscosity on Porosity and Mechanical Properties of Surface Mount Solder Joints
IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part B
Related publications
Evaluation Method of Thermal Fatigue Life for Surface-Mount Solder Joints by Mechanical Fatigue Test.
Transactions of the Japan Society of Mechanical Engineers Series A
Lead-Free Solder Paste and VOC-Free Solder Paste.
Journal of SHM
Solder Joints Detection Method Based on Surface Recovery
Computer and Information Science
Evaluation of Fatigue Crack Initiation and Extension Life in Microelectronics Solder Joints of Surface Mount Type.
JSME International Journal Series A
Properties of Sn-Ag-Bi-In Solder Joints
Nippon Kinzoku Gakkaishi/Journal of the Japan Institute of Metals
Mechanics of Materials
Alloys
Materials Chemistry
Condensed Matter Physics
Metals
Solder Paste Process of Hybrid Circuits
ElectroComponent Science and Technology
Effect of Grain Boundary Misorientation on Electromigration in Lead-Free Solder Joints
Journal of Electronic Materials
Electronic Engineering
Condensed Matter Physics
Optical
Materials Chemistry
Electrical
Magnetic Materials
Electronic
The Effect of Carbon Nanotube Loading on Wettability of Solder Paste SAC 237 and Different Substrates
International Journal on Advanced Science, Engineering and Information Technology
Agricultural
Engineering
Computer Science
Biological Sciences
Mechanical Properties and Microstructure of Tin-Silver-Bismuth Lead-Free Solder
Materials Transactions
Mechanics of Materials
Materials Science
Condensed Matter Physics
Mechanical Engineering
