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Publications by J.N. Sweet
High Accuracy Die Mechanical Stress Measurement With the ATC04 Assembly Test Chip
Stresses From Flip-Chip Assembly and Underfill; Measurements With the ATC4.1 Assembly Test Chip and Analysis by Finite Element Method
Evaluating Plastic Assembly Processes for High Reliability Applications Using HAST and Assembly Test Chips
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Evaluation of Stress and Strain Measurement Accuracy in Hydraulic Bulge Test With the Aid of Finite-Element Analysis
ISIJ International
Mechanics of Materials
Alloys
Materials Chemistry
Metals
Mechanical Engineering
High Accuracy Multiviewpoint Stereo Measurement.
Nippon Kikai Gakkai Ronbunshu, C Hen/Transactions of the Japan Society of Mechanical Engineers, Part C
Mechanics of Materials
Industrial
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Manufacturing Engineering
Alignment Measurement Technique for Satellite Assembly, Integration, and Test
International Journal of ADVANCED AND APPLIED SCIENCES
High Accuracy Momentum Compaction Measurement for the APS Storage Ring With Undulator Radiation
AIP Conference Proceedings
Astronomy
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Microcomb Design and Fabrication for High Accuracy Optical Assembly
Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures
Endoscopic Sinus Surgery Support Mechanism With Mechanical Impedance Characteristics for High Accuracy Positioning
Nippon Kikai Gakkai Ronbunshu, C Hen/Transactions of the Japan Society of Mechanical Engineers, Part C
Mechanics of Materials
Industrial
Mechanical Engineering
Manufacturing Engineering
On-Chip Transportation and Measurement of Mechanical Characteristics of Oocytes in an Open Environment
Micromachines
Control
Systems Engineering
Electrical
Mechanical Engineering
Electronic Engineering
Accuracy of Measurement in the Classical and the Modern Test Theory: An Empirical Study on a Children Intelligence Test
International Journal of Psychological Studies