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Publications by J.W. Xian

Influence of Ni on the Refinement and Twinning of Primary Cu6Sn5 in Sn-0.7Cu-0.05Ni

Intermetallics
Mechanics of MaterialsAlloysMechanical EngineeringMetalsMaterials ChemistryChemistry
2018English

Heterogeneous Nucleation of Cu6Sn5 in Sn–Cu–Al Solders

Journal of Alloys and Compounds
Mechanics of MaterialsAlloysMaterials ChemistryMetalsMechanical Engineering
2015English

Related publications

Experiences in the Determination and Refinement of Structures Involving Twinning

Acta Crystallographica Section A Foundations of Crystallography
1996English

On the Deformation Twinning in Fe-Ni-C Martensite

Nippon Kinzoku Gakkaishi/Journal of the Japan Institute of Metals
Mechanics of MaterialsAlloysMaterials ChemistryCondensed Matter PhysicsMetals
1964English

INFLUENCE OF MODIFCATION ON THE REFINEMENT OF PRIMARY SILICON CRYSTALS IN HYPEREUTECTIC SILUMIN AlSi21CuNi

Production Engineering Archives
2018English

Fatigue Damage Evaluation by Surface Feature for Sn–3.5Ag and Sn–0.7Cu Solders

Materials Transactions
Mechanics of MaterialsMaterials ScienceCondensed Matter PhysicsMechanical Engineering
2005English

Effect of Trace Ge on Wettability and High-Temperature Oxidation Resistance of Sn-0.7Cu Lead-Free Solder

Materials Transactions
Mechanics of MaterialsMaterials ScienceCondensed Matter PhysicsMechanical Engineering
2016English

Precipitation in a Cu-20%Ni-8%Sn Alloy and the Phase Diagram of the Cu-Ni Rich Cu-Ni-Sn System

Nippon Kinzoku Gakkaishi/Journal of the Japan Institute of Metals
Mechanics of MaterialsAlloysMaterials ChemistryCondensed Matter PhysicsMetals
1983English

Influence of Ultrasonic Melt Treatment on the Formation of Primary Intermetallics and Related Grain Refinement in Aluminum Alloys

Journal of Materials Science
Mechanics of MaterialsMaterials ScienceMechanical Engineering
2011English

Influence of Activated Carbon Particles on Intermetallic Compound Growth Mechanism in Sn-Cu-Ni Composite Solder

MATEC Web of Conferences
Materials ScienceEngineeringChemistry
2016English

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