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Publications by Jer-Haur Kuo
The Simulation of Shape Evolution of Solder Joints During Reflow Process and Its Experimental Validation
Materials Transactions
Mechanics of Materials
Materials Science
Condensed Matter Physics
Mechanical Engineering
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Microstructural Evolution of Eutectic Au-Sn Solder Joints
Suppression of Cu 6 Sn 5 in TiO 2 Reinforced Solder Joints After Multiple Reflow Cycles
Materials and Design
Mechanics of Materials
Materials Science
Mechanical Engineering
Simulation and Experimental Validation of the Hot Embossing Process of Poly(lactic-Co-Glycolic Acid) Microstructures
International Journal of Polymer Science
Polymers
Plastics
Solder Paste Reflow Modeling for Flip Chip Assembly
The Effect of Solder Paste Viscosity on Porosity and Mechanical Properties of Surface Mount Solder Joints
IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part B
Industrial Urea Process – Simulation and Validation
International Journal of Advanced Engineering Research and Science
Simulation Study on the Optimum Conditions of Liposomes for Antitumor Effect of Doxorubicin and Its Experimental Validation
Drug Metabolism and Pharmacokinetics
The Characteristics of Electromigration and Thermomigration in Flip Chip Solder Joints
Properties of Sn-Ag-Bi-In Solder Joints
Nippon Kinzoku Gakkaishi/Journal of the Japan Institute of Metals
Mechanics of Materials
Alloys
Materials Chemistry
Condensed Matter Physics
Metals
