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Publications by Jicheng Gong

Formation of Sn Dendrites and SnAg Eutectics in a SnAgCu Solder

Scripta Materialia
Mechanics of MaterialsMaterials ScienceAlloysCondensed Matter PhysicsMechanical EngineeringMetalsNanoscienceNanotechnology
2009English

Related publications

In Situ Investigation of SnAgCu Solder Alloy Microstructure

Journal of Alloys and Compounds
Mechanics of MaterialsAlloysMaterials ChemistryMetalsMechanical Engineering
2011English

Phase Formation Between Lead-Free Sn–Ag–Cu Solder and Ni(P)∕Au Finishes

Journal of Applied Physics
AstronomyPhysics
2006English

Solidification and Wetting Behaviour of SnAgCu Solder Alloyed by Reactive Metal Organic Flux

Soldering and Surface Mount Technology
Electronic EngineeringElectricalCondensed Matter PhysicsMaterials Science
2010English

Properties of Sn-Ag-Bi-In Solder Joints

Nippon Kinzoku Gakkaishi/Journal of the Japan Institute of Metals
Mechanics of MaterialsAlloysMaterials ChemistryCondensed Matter PhysicsMetals
2005English

Creep and Creep Rupture of Sn-95Pb Solder.

Transactions of the Japan Society of Mechanical Engineers Series A
2001English

Early Dissolution Behavior of Copper in a Molten Sn–Zn–Ag Solder

Journal of Materials Research
Mechanics of MaterialsMaterials ScienceCondensed Matter PhysicsMechanical Engineering
2005English

Microstructural Evolution of Eutectic Au-Sn Solder Joints

2002English

Structure and Kinetics of Sn Whisker Growth on Pb-Free Solder Finish

English

Coarsening of the Sn-Pb Solder Microstructure in Constitutive Model-Based Predictions of Solder Joint Thermal Mechanical Fatigue

Journal of Electronic Materials
Electronic EngineeringCondensed Matter PhysicsOpticalMaterials ChemistryElectricalMagnetic MaterialsElectronic
1999English

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