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Publications by Jie-An Lin
Formation Mechanism of Porous Cu3Sn Intermetallic Compounds by High Current Stressing at High Temperatures in Low-Bump-Height Solder Joints
Crystals
Materials Science
Inorganic Chemistry
Chemical Engineering
Condensed Matter Physics
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High Speed Oblique CT System for Solder Bump Inspection
Experiments in Corrosion Mechanism: Aluminum at High Temperatures
High Reliability Design for Micro Solder Joints by Means of Computational Mechanics.
Journal of SHM
High-Precision Cutting of Titanium Aluminide Intermetallic Compounds.
Nippon Kikai Gakkai Ronbunshu, C Hen/Transactions of the Japan Society of Mechanical Engineers, Part C
Mechanics of Materials
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Mechanical Characterization of Lead-Free Sn-Ag-Cu Solder Joints by High-Temperature Nanoindentation
Journal of Electronic Materials
Electronic Engineering
Condensed Matter Physics
Optical
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Magnetic Materials
Electronic
Mechanical Properties of High Purity Iron at Low Temperatures
Transactions of the Japan Institute of Metals
Pb-Free High Temperature Solder Joints for Power Semiconductor Devices
Transactions of The Japan Institute of Electronics Packaging
Magnetic Susceptibility and Parameters of Electronic Structure of Al2R (R = La, Ce, Sm, Gd, Dy, Ho, Yb) Intermetallic Compounds at High Temperatures.
EPJ Web of Conferences
Astronomy
Physics
Perovskite-Type Oxids With Low Resistivity and High Stability at High Temperatures in Air
Funtai Oyobi Fummatsu Yakin/Journal of the Japan Society of Powder and Powder Metallurgy
Alloys
Industrial
Mechanical Engineering
Metals
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