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Publications by Jitsuho Hirota
Structure and Subject of BGA/CSP Attractive New Packages.
Yosetsu Gakkai Shi/Journal of the Japan Welding Society
Mechanics of Materials
Surfaces
Alloys
Mechanical Engineering
Metals
Films
Coatings
Related publications
Packaging Technology of BGA/CSP. Tape-Type BGA/CSP Technology.
The Journal of Japan Institute for Interconnecting and Packaging Electronic Circuits
Versatile Thymine DNA Glycosylase (TDG): Attractive Subject of Future Research and Potential Target for Therapeutics
Journal of Biomolecular Research & Therapeutics
Bifurcation Study of Regular Pulse Packages in Laser Diodes Subject to Optical Feedback
Physical Review E
Bat Guano as New and Attractive Chitin and Chitosan Source
Frontiers in Zoology
Evolution
Ecology
Systematics
Animal Science
Behavior
Zoology
A New Formulation for Attractive Term of Equation of State
Nihon Kikai Gakkai Ronbunshu, B Hen/Transactions of the Japan Society of Mechanical Engineers, Part B
Condensed Matter Physics
Mechanical Engineering
EMC of Semiconductor Packages. Thermal Performance and EMC of Semiconductor Packages.
Journal of Japan Institute of Electronics Packaging
Electronic Engineering
Electrical
Stress Analysis and Its Application to Structure Design for IC Plastic Packages.
HYBRIDS
Bioenergetics and Transport - A New Subject Category
Microbiology
Microbiology
Subject Hierarchy Structure Modeling in Data Warehouse
International Journal of Database Theory and Application
Computer Science