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Publications by John E. Ferguson
Creating Low-Impedance Tetrodes by Electroplating With Additives
Sensors and Actuators, A: Physical
Surfaces
Electronic Engineering
Alloys
Condensed Matter Physics
Instrumentation
Metals
Optical
Electrical
Magnetic Materials
Films
Coatings
Electronic
Related publications
Plating Time Dependence of Filling Ability With Additives by Copper Electroplating.
Journal of Japan Institute of Electronics Packaging
Electronic Engineering
Electrical
Effects of Organic Additives on Initial Stages of Zinc Electroplating on Iron
Journal of the Electrochemical Society
Surfaces
Condensed Matter Physics
Optical
Electrochemistry
Sustainability
Materials Chemistry
Magnetic Materials
Renewable Energy
Films
Coatings
Electronic
the Environment
Creating Dynamic Equivalent PV Circuit Models With Impedance Spectroscopy for Arc Fault Modeling
Development of a Movable Collimator With Low Beam Impedance
Preliminary Study on Electroplating by Vibration Method
Journal of the Metal Finishing Society of Japan
Fabrication of Thin Palladium Membrane by Electroplating Coexisting With Supercritical Carbon Dioxide
MEMBRANE
Dual-Band Low Profile Directional Antenna With High Impedance Surface Reflector
Progress In Electromagnetics Research Letters
Optical
Electronic
Magnetic Materials
Study on the Effects of Agitation and Additives on Nickel Electrodeposition From Watt's Bath by Interfacial AC Impedance Technique.
Journal of the Surface Finishing Society of Japan
Bench Measurements of Low Frequency Transverse Impedance
