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Publications by John H. Lau
Overview and Outlook of Three-Dimensional Integrated Circuit Packaging, Three-Dimensional Si Integration, and Three-Dimensional Integrated Circuit Integration
Journal of Electronic Packaging, Transactions of the ASME
Mechanics of Materials
Electronic Engineering
Optical
Computer Science Applications
Electrical
Magnetic Materials
Electronic
Related publications
Research on Physical Unclonable Functions Circuit Based on Three Dimensional Integrated Circuit
IEICE Electronics Express
Electronic Engineering
Condensed Matter Physics
Optical
Electrical
Magnetic Materials
Electronic
Three Dimensional Integration (3DI) of Semiconductor Circuit Layers: New Devices and Fabrication Process
Three-Dimensional Integration and Visualization of Structural Field Data :
Thermal Model for Three-Dimensional Integrated Circuits With Integrated MLGNR-based TSV
Thermal Science
Renewable Energy
the Environment
Sustainability
Low-Temperature Wafer Bonding for Three-Dimensional Wafer-Scale Integration
Three-Dimensional Liver Surgery Simulation: Computer-Assisted Surgical Planning With Three-Dimensional Simulation Software and Three-Dimensional Printing
Tissue Engineering - Part A.
Biochemistry
Bioengineering
Biomedical Engineering
Biomaterials
Integration of Active and Passive Sensing Techniques for Representing Three-Dimensional Objects
IEEE Transactions on Robotics and Automation
High-Level Integration of Three-Dimensional Microcoils Array in Fused Silica
Optics Letters
Optics
Atomic
Molecular Physics,
Three-Dimensional Materials Science: An Intersection of Three-Dimensional Reconstructions and Simulations
MRS Bulletin
Materials Science
Theoretical Chemistry
Condensed Matter Physics
Physical
