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Publications by Joydeep Mitra

A Fast Simulation Framework for Full-Chip Thermo-Mechanical Stress and Reliability Analysis of Through-Silicon-Via Based 3D ICs

English

Identification of N-Glycosylation Sites With Sequence and Structural Features Employing Random Forests

Lecture Notes in Computer Science

Computer Science

Theoretical Computer Science

English

Related publications

Electrical Modeling and Characterization of Through Silicon via for Three-Dimensional ICs

IEEE Transactions on Electron Devices

Electronic Engineering

Magnetic Materials

English

Experimental Stress Characterization and Numerical Simulation for Copper Pumping Analysis of Through-Silicon Vias

IEEE Transactions on Components, Packaging and Manufacturing Technology

Electronic Engineering

Manufacturing Engineering

Magnetic Materials

English

KLauS – A Charge Readout and Fast Discrimination Chip for Silicon Photomultipliers

Journal of Instrumentation

Instrumentation

Mathematical Physics

English

Stress Analysis for Cylinder Made of FGM and Subjected to Thermo-Mechanical Loadings

Materials Science

English

Analysis of Parallelization Efficiency of Coupled Thermo-Hydro-Mechanical Simulation

Journal of Environmental Science for Sustainable Society

English

Multi-Functional Interconnect Co-Optimization for Fast and Reliable 3D Stacked ICs

English

Signal Integrity Analysis in Carbon Nanotube Based Through-Silicon Via

Active and Passive Electronic Components

Electronic Engineering

Magnetic Materials

English

3D Convolutional GAN for Fast Simulation

EPJ Web of Conferences

English

X-Ray Nanodiffraction Analysis of Stress Oscillations in a W Thin Film on Through-Silicon Via

Journal of Applied Crystallography

Molecular Biology

English