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Publications by Ju HU

The Analysis of the Key Technologies of the Packaging Device Applied for the Epoxy Moulding Materials

DEStech Transactions on Materials Science and Engineering

English

Fine Resolution Simulation of a Cold Vortex in Northeast China by Using a Meso-Scale Meteorological Model

DEStech Transactions on Computer Science and Engineering

English

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Effects of the Vacuum Moulding Process on the Mechanical Properties of Cotton/Epoxy Composite

Fibres and Textiles in Eastern Europe

Materials Science

Environmental Science

International Management

Manufacturing Engineering

English

Packaging Technologies of Optical Circuits. Possibility of Polymers for Lightwave Guide Materials.

The Journal of Japan Institute for Interconnecting and Packaging Electronic Circuits

English

Microalgae Biopeptides Applied in Nanofibers for the Development of Active Packaging

Organic Chemistry

Chemical Engineering

English

Thermophysical Aspects of Reclaimed Moulding Sand Addition to the Epoxy-So2 Coremaking System Studied by Fourier Thermal Analysis

Journal of Thermal Analysis and Calorimetry

Theoretical Chemistry

Condensed Matter Physics

English

Multiprocessor Modeling Technologies for the Applied Statistical Tasks

System technologies

English

Promising Technologies and Trend of Print Circuit Board for the Electronics Packaging

Journal of Japan Institute of Electronics Packaging

Electronic Engineering

English

The Full Impact of Advanced Materials Technologies

Advanced Materials Technologies

Mechanics of Materials

Materials Science

Manufacturing Engineering

English

Optimization of Compression Moulding Temperature for Polypropylene Materials

Materialpruefung/Materials Testing

Mechanics of Materials

Materials Science

Mechanical Engineering

English

Finite-Key Analysis for Measurement-Device-Independent Quantum Key Distribution

Nature Communications

Molecular Biology

English