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Publications by K. Nogita

Suppression of Cu 6 Sn 5 in TiO 2 Reinforced Solder Joints After Multiple Reflow Cycles

Materials and Design
Mechanics of MaterialsMaterials ScienceMechanical Engineering
2016English

Influence of Ni on the Refinement and Twinning of Primary Cu6Sn5 in Sn-0.7Cu-0.05Ni

Intermetallics
Mechanics of MaterialsAlloysMechanical EngineeringMetalsMaterials ChemistryChemistry
2018English

Related publications

Interfacial Reactions in Sn-57Bi-1Ag Solder Joints With Cu and Au Metallization

Materials Transactions
Mechanics of MaterialsMaterials ScienceCondensed Matter PhysicsMechanical Engineering
2016English

Properties of Sn-Ag-Bi-In Solder Joints

Nippon Kinzoku Gakkaishi/Journal of the Japan Institute of Metals
Mechanics of MaterialsAlloysMaterials ChemistryCondensed Matter PhysicsMetals
2005English

Improving Tensile and Fatigue Properties of Sn–58Bi/Cu Solder Joints Through Alloying Substrate

Journal of Materials Research
Mechanics of MaterialsMaterials ScienceCondensed Matter PhysicsMechanical Engineering
2010English

Mechanical Characterization of Lead-Free Sn-Ag-Cu Solder Joints by High-Temperature Nanoindentation

Journal of Electronic Materials
Electronic EngineeringCondensed Matter PhysicsOpticalMaterials ChemistryElectricalMagnetic MaterialsElectronic
2013English

Microstructural Evolution of Eutectic Au-Sn Solder Joints

2002English

The Role of Intermetallic Compounds in Controlling the Microstructural, Physical and Mechanical Properties of Cu-[Sn-Ag-Cu-Bi]-Cu Solder Joints

Scientific Reports
Multidisciplinary
2019English

Microstructure of Interface Between Sn-Cu Solder With Ni and Cu Plate

Nippon Kinzoku Gakkaishi/Journal of the Japan Institute of Metals
Mechanics of MaterialsAlloysMaterials ChemistryCondensed Matter PhysicsMetals
2006English

Microstructures and Properties of New Sn–Ag–Cu Lead-Free Solder Reinforced With Ni-Coated Graphene Nanosheets

Journal of Alloys and Compounds
Mechanics of MaterialsAlloysMaterials ChemistryMetalsMechanical Engineering
2016English

The Simulation of Shape Evolution of Solder Joints During Reflow Process and Its Experimental Validation

Materials Transactions
Mechanics of MaterialsMaterials ScienceCondensed Matter PhysicsMechanical Engineering
2006English

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