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Publications by K. Nogita

Suppression of Cu 6 Sn 5 in TiO 2 Reinforced Solder Joints After Multiple Reflow Cycles

Materials and Design
Mechanics of MaterialsMaterials ScienceMechanical Engineering
2016English

Influence of Ni on the Refinement and Twinning of Primary Cu6Sn5 in Sn-0.7Cu-0.05Ni

Intermetallics
Mechanics of MaterialsAlloysMechanical EngineeringMetalsMaterials ChemistryChemistry
2018English

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