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Publications by K. Tikhomirov
Solder Joints Reliability Prediction. Thermo-Mechanical Fatigue: The Models Based on Creep Strain. Part 2
ELECTRONICS: Science, Technology, Business
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Evaluation Method of Thermal Fatigue Life for Surface-Mount Solder Joints by Mechanical Fatigue Test.
Transactions of the Japan Society of Mechanical Engineers Series A
Creep-Fatigue Life Assessment for Sn-3.0Ag-0.5Cu Solder
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Elastic-Creep Finite Element Analysis of Solder Joints and Experimental Verification Using a Diffused Type Strain Gauge.
Transactions of the Japan Society of Mechanical Engineers Series A
The Effect of Solder Paste Viscosity on Porosity and Mechanical Properties of Surface Mount Solder Joints
IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part B
Solder Joints Detection Method Based on Surface Recovery
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Creep-Fatigue Damage Rule Under Variable Straining Based on Strain Range Partitioning Concept
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Coarsening of the Sn-Pb Solder Microstructure in Constitutive Model-Based Predictions of Solder Joint Thermal Mechanical Fatigue
Journal of Electronic Materials
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Micro-Mechanics of Creep-Fatigue Damage in PB-SN Solder Due to Thermal Cycling—Part I: Formulation
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The Current Situation and Challenges of Strength Reliability Evaluation for Solder Joints
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