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Publications by K.E. Yazzie
Mechanical Characterization of Lead-Free Sn-Ag-Cu Solder Joints by High-Temperature Nanoindentation
Journal of Electronic Materials
Electronic Engineering
Condensed Matter Physics
Optical
Materials Chemistry
Electrical
Magnetic Materials
Electronic
Related publications
Microstructure Characterization of Sn-Ag-Cu Lead-Free Solder Solidified at Different Cooling Speeds
Microscopy and Microanalysis
Instrumentation
Thermodynamic Analysis and Characterization of Bi–Cu–Sn Alloys as Advanced Lead-Free Solder Materials for High Temperature Application
Journal of Materials Science: Materials in Electronics
Electronic Engineering
Biomedical Engineering
Condensed Matter Physics
Biomaterials
Electronic
Molecular Physics,
Biophysics
Optical
Electrical
Atomic
Magnetic Materials
Bioengineering
Optics
Phase Formation Between Lead-Free Sn–Ag–Cu Solder and Ni(P)∕Au Finishes
Journal of Applied Physics
Astronomy
Physics
Rupture Life of CSP Solder Joints With Sn-Ag Lead-Free Solders Under Thermal Cycle Condition.
Journal of Japan Institute of Electronics Packaging
Electronic Engineering
Electrical
Interface Reaction and Mechanical Properties of Lead-Free Sn-Zn Alloy/Cu Joints
Materials Transactions
Mechanics of Materials
Materials Science
Condensed Matter Physics
Mechanical Engineering
The Role of Intermetallic Compounds in Controlling the Microstructural, Physical and Mechanical Properties of Cu-[Sn-Ag-Cu-Bi]-Cu Solder Joints
Scientific Reports
Multidisciplinary
Properties of Sn-Ag-Bi-In Solder Joints
Nippon Kinzoku Gakkaishi/Journal of the Japan Institute of Metals
Mechanics of Materials
Alloys
Materials Chemistry
Condensed Matter Physics
Metals
Microstructures and Properties of New Sn–Ag–Cu Lead-Free Solder Reinforced With Ni-Coated Graphene Nanosheets
Journal of Alloys and Compounds
Mechanics of Materials
Alloys
Materials Chemistry
Metals
Mechanical Engineering
Study on Sn–Ag Oxidation and Feasibility of Room Temperature Bonding of Sn–Ag–Cu Solder
Materials Transactions
Mechanics of Materials
Materials Science
Condensed Matter Physics
Mechanical Engineering
