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Publications by Kanji OTSUKA

Electronic Packaging Technology View From System Design. Packaging Technology Made New Capability in Electronics Use.

Journal of the Surface Finishing Society of Japan

English

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Packaging Technology of SiC Power Electronics

Journal of Japan Institute of Electronics Packaging

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The Activity of “Electronics Packaging Technology Symposium”

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Present Conditions and Perspective of Electronics Components &Amp; Electronics Packaging Technology

Journal of Japan Institute of Electronics Packaging

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Special Articles: Theme of Advanced Assembly and Packaging Technology. Breakthrough in Packaging Technology.

Circuit Technology

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SLC/FCA Packaging Technology.

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Future Plating Technology for Next Generation High Density Electronic Packaging

Journal of The Surface Finishing Society of Japan

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Recent Activities in Semiconductor Packaging Technology

Journal of Japan Institute of Electronics Packaging

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Special Technology Area Review on Microwave Packaging Technology

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Co-Fired AlN–TiN Assembly as a New Substrate Technology for High-Temperature Power Electronics Packaging

Ceramics International

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Magnetic Materials

English