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Publications by Katsuya Akamatsu

Pulsed Electric-Current Bonding of SiC to Cu With Ti Intermediate Layer

Nippon Kinzoku Gakkaishi/Journal of the Japan Institute of Metals

Mechanics of Materials

Materials Chemistry

Condensed Matter Physics

English

Related publications

Effect of Electric Current Wave on Joints in Pulsed Electric Current Bonding

Nippon Kinzoku Gakkaishi/Journal of the Japan Institute of Metals

Mechanics of Materials

Materials Chemistry

Condensed Matter Physics

English

Microstructure of Reaction Layer and Its Effect on the Joining Strength of SiC/SiC Joints Brazed Using Ag-Cu-In-Ti Alloy

Journal of Advanced Ceramics

Magnetic Materials

English

Reaction Layer and Bonding Strength at the Interface of Ruby and Ag-Cu-Ti Brazing-Filter. Study on Bonding of Ruby to Metals. (Report 1).

Yosetsu Gakkai Ronbunshu/Quarterly Journal of the Japan Welding Society

Mechanics of Materials

Mechanical Engineering

English

Pulsed Current Sintering of Mechanically Alloyed Ni-Ti Powder

Nippon Kinzoku Gakkaishi/Journal of the Japan Institute of Metals

Mechanics of Materials

Materials Chemistry

Condensed Matter Physics

English

Pulsed Electric Current Sintering of Transparent Alumina Ceramics

English

Surface Observation of Pulsed Electric Current Sintered Alumina Balls.

Journal of the Ceramic Society of Japan

English

Preparation of Silica Glass by Pulsed Electric Current Method.

Journal of the Ceramic Society of Japan

English

Transient Liquid Phase Bonding Process in SiC Fiber Reinforced Ti-6Al-4v Composites.

ISIJ International

Mechanics of Materials

Materials Chemistry

Mechanical Engineering

English

Effect of Initial Electric Current on Joints of Bonded SUS304 Stainless Steel Using a Pulse Electric Current Bonding Process

Nippon Kinzoku Gakkaishi/Journal of the Japan Institute of Metals

Mechanics of Materials

Materials Chemistry

Condensed Matter Physics

English