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Publications by Katsuya Kikuchi
Fabrication of High-Density Wiring Interposer for 10 GHz 3D Packaging Using a Photosensitive Multiblock Copolymerized Polyimide
Japanese Journal of Applied Physics, Part 1: Regular Papers & Short Notes
Engineering
Astronomy
Physics
Related publications
A Soluble Photosensitive Polyimide
Use of Photosensitive Polyimide for Deep X‐ray Lithography
Applied Physics Letters
Astronomy
Physics
Application of Photosensitive Polyimide: Mask Saving Process for Buffer Coating.
Journal of Photopolymer Science and Technology
Organic Chemistry
Polymers
Materials Chemistry
Plastics
Fabrication of High-Density Peptide Arrays
Science-Business eXchange
10 GHz VCOs for High-Speed Serial Data Communication ICs
Future Plating Technology for Next Generation High Density Electronic Packaging
Journal of The Surface Finishing Society of Japan
Study on Thermal Curing in Ester Type Photosensitive Polyimide.
Journal of Photopolymer Science and Technology
Organic Chemistry
Polymers
Materials Chemistry
Plastics
Package-Interposer-Package (PIP): A Breakthrough Package-On-Package (PoP) Technology for 3d-Integration
International Symposium on Microelectronics
Trends in High Density Packaging Technologies. Trends in Evaluation of Reliability With High Density Packaging Technologies-Present and Future in Evaluation of Reliability.
The Journal of Japan Institute for Interconnecting and Packaging Electronic Circuits
