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Publications by Katsuyuki AIDA
Morphologies and Properties of Cured Epoxy/Phenoxy/Cycrophenoxyphosphazen(CPP)Blends as Adhesives for Flexible Printed Circuits (FPCs)
Journal of The Adhesion Society of Japan
Related publications
Morphologies and Properties of Cured Epoxy/Brominated- Phenoxy Blends as Adhesives for Flexible Printed Cirquits (FPCs)
Journal of The Adhesion Society of Japan
Cohesive Properties of Environmentally Degraded Epoxy Adhesives
U.Porto Journal of Engineering
Manufacturing Process of Flexible Printed Circuits(FPC).
Circuit Technology
(Invited) Printed Organic TFTs on Flexible Substrate for Complementary Circuits
ECS Transactions
Engineering
Dilatometric Properties of Epoxy Resins Cured With Organic Acid Anhydride.
The Journal of the Society of Chemical Industry, Japan
Planar Patterned Stretchable Electrode Arrays Based on Flexible Printed Circuits
Journal of Micromechanics and Microengineering
Mechanics of Materials
Electronic Engineering
Mechanical Engineering
Nanoscience
Optical
Electrical
Magnetic Materials
Nanotechnology
Electronic
Stripping of Cured Epoxy Resins
Journal of the Japan Society of Colour Material
Superhydrophobic Inkjet Printed Flexible Graphene Circuits via Direct-Pulsed Laser Writing
Nanoscale
Materials Science
Nanotechnology
Nanoscience
Effects of ABS-g-MAH on Morphologies and Properties of PC/ASA/PMMA Blends
