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Publications by Kazuma MIURA
Au-Ag Heat-Press Bonding Technology for Multi-Lsi Package.
Zairyo/Journal of the Society of Materials Science, Japan
Mechanics of Materials
Materials Science
Condensed Matter Physics
Mechanical Engineering
Related publications
Use of Multi-Phase Trip Steel for Press-Hardening Technology
Acta Metallurgica Slovaca
Alloys
Metals
Inductancce Calculation of a Conductor in an LSI Package
Journal of the Magnetics Society of Japan
Synthesis of Au, Ag, Curcumin Au/Ag, and Au-Ag Nanoparticles and Their Nonlinear Refractive Index Properties
Journal of Nanomaterials
Materials Science
Nanotechnology
Nanoscience
Superconducting Electronics. Josephson Digital LSI Technology.
TEION KOGAKU (Journal of Cryogenics and Superconductivity Society of Japan)
Package-Interposer-Package (PIP): A Breakthrough Package-On-Package (PoP) Technology for 3d-Integration
International Symposium on Microelectronics
SERS Comparison From Au, Ag, and Au-Ag Alloys: Insights by the First Principles
Enhancement of Chitosan-Graphene Oxide SPR Sensor With a Multi-Metallic Layers of Au–Ag–Au Nanostructure for Lead(II) Ion Detection
Applied Surface Science
Surfaces
Astronomy
Condensed Matter Physics
Interfaces
Films
Coatings
Chemistry
Physics
Study of Impingement Cooling of Heat Sinks for LSI Packages With Longitudinal Fins.
Nihon Kikai Gakkai Ronbunshu, B Hen/Transactions of the Japan Society of Mechanical Engineers, Part B
Condensed Matter Physics
Mechanical Engineering
The Nature of Bonding in Metal-Metal Singly Bonded Coinage Metal Dimers: Cu 2 , Ag 2 and Au 2
Computational and Theoretical Chemistry
Biochemistry
Theoretical Chemistry
Condensed Matter Physics
Physical
