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Publications by Kazuya SEKIGUCHI
Development of New Micro Saw Wire Bonded With Diamond Grains Using Metal Solder
International Journal of the Society of Materials Engineering for Resources
Materials Science
Chemical Engineering
Mechanical Engineering
Related publications
Development of Metal Bonded Porous Diamond Wheel and Its Grinding Performance.
Seimitsu Kogaku Kaishi/Journal of the Japan Society for Precision Engineering
Mechanical Engineering
Laser Dressing of Metal Bonded Diamond Wheel
Journal of the Society of Mechanical Engineers
Development of Electrodeposited Endless Wire Tool of Diamond Grains. Welding Method and Evaluation of Welding Point.
Seimitsu Kogaku Kaishi/Journal of the Japan Society for Precision Engineering
Mechanical Engineering
Development of a Resinoid Diamond Wire Tool Utilizing Ultraviolet Curing Resin.
Seimitsu Kogaku Kaishi/Journal of the Japan Society for Precision Engineering
Mechanical Engineering
Study on Slicing Mechanism of Multi-Wire Saw
Journal of the Japan Society for Precision Engineering, Contributed Papers
Development of Micro-Plasma Wire Deposition Process for Layered Manufacturing
DAAAM International Scientific Book
Development of Melamine-Bonded Diamond Wheels With High Porosity for Smooth and Mirror Finishing of Die Materials.
Nippon Kikai Gakkai Ronbunshu, C Hen/Transactions of the Japan Society of Mechanical Engineers, Part C
Mechanics of Materials
Industrial
Mechanical Engineering
Manufacturing Engineering
Instruments and Methods: Diamond Wire-Saw Cutting Technique for Investigating Textures and Fabrics of Debris-Laden Ice and Brittle Ice
Journal of Glaciology
Earth-Surface Processes
Measurement of Foil Bonded Strain Gauges With 3 Wire Quarter Bridge
DEStech Transactions on Engineering and Technology Research
