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Publications by Keiichi Niwa
Shear Strength of Cu-To-Cu Joints Using Mixed Ag Particle Paste
Yosetsu Gakkai Ronbunshu/Quarterly Journal of the Japan Welding Society
Mechanics of Materials
Surfaces
Alloys
Mechanical Engineering
Metals
Films
Coatings
Related publications
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Joining of Pure Copper Using Cu Nanoparticles Derived From CuO Paste
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Effects of Thermal Storage and Cu Addition on Adhesive Strength and Microstructure of Sn-3.0 Mass% Ag-1.5 Mass% Sb-xCu Solder Joints
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