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Publications by Keiko OHTSUKA
Curing Behavior and Properties of Phenolic Resin/Clay Nanocomposite
Kobunshi Ronbunshu
Materials Science
Polymers
Plastics
Chemical Engineering
Environmental Science
Polymer Materials. Photopolymerization of Vinylester Resin Having Hydroxymethyl Group.
Zairyo/Journal of the Society of Materials Science, Japan
Mechanics of Materials
Materials Science
Condensed Matter Physics
Mechanical Engineering
Related publications
Preparation and Mechanical Properties of NBR/Clay Nanocomposite
Polymer (Korea)
Polymers
Materials Chemistry
Plastics
Chemical Engineering
Preparation and Application of Novel Nanocomposite Coating Materials Based on Phenolic Resin
Asian Journal of Chemistry
Chemistry
Properties of Extruded Xanthan-Starch-Clay Nanocomposite Films
Brazilian Archives of Biology and Technology
Multidisciplinary
The Relation Between the Curing Conditions and Mechanical Properties of Polyimide Resin
Seikei-Kakou
Enhanced Mechanical, Thermal and Barrier Properties of Clay-Based Polymer Nanocomposite Systems
Epitoanyag - Journal of Silicate Based and Composite Materials
Strain Rate Dependent Behavior of Glass/Nano Clay Filled Epoxy Resin Composite
Defence Science Journal
Electronic Engineering
Mechanical Engineering
Physics
Computer Science Applications
Electrical
Chemical Engineering
Astronomy
Biomedical Engineering
Phenolic Resin Syntactic Foams
In Vitro Evaluation of Physical and Mechanical Properties of Light-Curing Resin Cement: A Comparative Study
European Journal of Dentistry
Dentistry
Synthesis of Cyanoguanidine Derivertives and Thermal Curing Reaction of Epoxy Resin; Properties of the Cured Resins.
NIPPON KAGAKU KAISHI
