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Publications by Keisuke Hayabusa
Copper Bottom-Up Deposition by Breakdown of PEG-Cl Inhibition
Electrochemical and Solid-State Letters
Related publications
Selective Inhibition of Cl− Conductance in Toad Skin by Blockers of Cl− Channels and Transporters
American Journal of Physiology - Cell Physiology
Physiology
Cell Biology
A Statistical Analysis of Copper Bottom Coverage of High-Aspect-Ratio Features Using Ionized Physical Vapor Deposition
IEEE Transactions on Semiconductor Manufacturing
Electronic Engineering
Industrial
Condensed Matter Physics
Manufacturing Engineering
Optical
Electrical
Magnetic Materials
Electronic
Antimicrobial Behavior of Novel Surfaces Generated by Electrophoretic Deposition and Breakdown Anodization
Colloids and Surfaces B: Biointerfaces
Surfaces
Colloid
Interfaces
Theoretical Chemistry
Medicine
Biotechnology
Surface Chemistry
Physical
Bottom-Up Control of Parasites
Ecosphere
Evolution
Ecology
Systematics
Behavior
Bottom-Up Earley Deduction
Bottom‐Up Assembly of Micro/Nanostructures
Advanced Materials Interfaces
Mechanics of Materials
Mechanical Engineering
Thermoconvection-Enhanced Deposition of Copper.
Top-Down or Bottom-Up?
Science
Multidisciplinary
Philosophy of Science
History
Bottom-Up Design of Software Agents
Communications of the ACM
Computer Science
