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Publications by Keisuke Yoshizawa
Thermal Fatigue Life Evaluation of Lead-Free Solder Joint of Chip Size Package With Underfill
Nippon Kinzoku Gakkaishi/Journal of the Japan Institute of Metals
Mechanics of Materials
Alloys
Materials Chemistry
Condensed Matter Physics
Metals
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Fatigue Characteristics of Lead-Free Solder Alloys.
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Evaluation of Non-Proportional Multiaxial Fatigue Strength of Lead-Free Solder With Elements Addition
MATEC Web of Conferences
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SAC–xTiO2 Nano-Reinforced Lead-Free Solder Joint Characterizations in Ultra-Fine Package Assembly
Soldering and Surface Mount Technology
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Evaluation Method of Thermal Fatigue Life for Surface-Mount Solder Joints by Mechanical Fatigue Test.
Transactions of the Japan Society of Mechanical Engineers Series A
Rupture Life of CSP Solder Joints With Sn-Ag Lead-Free Solders Under Thermal Cycle Condition.
Journal of Japan Institute of Electronics Packaging
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Reliability of Flip Chip Package^|^mdash;Thermal Stress on Flip Chip Joint^|^mdash;
Journal of Japan Institute of Electronics Packaging
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Lead-Free Solder Paste and VOC-Free Solder Paste.
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Growth Kinetics of Reaction Layers in Flip Chip Joints With Cu-Cored Lead-Free Solder Balls
Materials Transactions
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Coarsening of the Sn-Pb Solder Microstructure in Constitutive Model-Based Predictions of Solder Joint Thermal Mechanical Fatigue
Journal of Electronic Materials
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