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Publications by Ken TSUDA
Reliability Evaluation of Cyclic Thermal Stress Test Using Aluminum Chip Embedded Epoxy Resin Model.
Zairyo/Journal of the Society of Materials Science, Japan
Mechanics of Materials
Materials Science
Condensed Matter Physics
Mechanical Engineering
Related publications
Reliability of Flip Chip Package^|^mdash;Thermal Stress on Flip Chip Joint^|^mdash;
Journal of Japan Institute of Electronics Packaging
Electronic Engineering
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Mechanical and Thermal Properties of Chemically Modified Epoxy Resin
Open Journal of Synthesis Theory and Applications
Reliability Evaluation Model of Embedded System Based on Machine Learning Method
DEStech Transactions on Computer Science and Engineering
Study of Mutagenicity of Epoxy Resin Hardeners by Fluctuation Test.
Sangyo Igaku
Global Kinetics of Thermal Degradation of Flame-Retarded Epoxy Resin Formulations
Polymer Degradation and Stability
Mechanics of Materials
Polymers
Materials Chemistry
Condensed Matter Physics
Plastics
Energy-Aware Computation Duplication for Improving Reliability in Embedded Chip Multiprocessors
Thermal Conductivity of Epoxy Resin Reinforced With Magnesium Oxide Coated Multiwalled Carbon Nanotubes
International Journal of Polymer Science
Polymers
Plastics
Spontaneity Current of Epoxy Resin
IEEJ Transactions on Fundamentals and Materials
Electronic Engineering
Electrical
Study of Curing Kinetics and Thermal Degradation of UV Curable Epoxy Acrylate Resin
E-Journal of Chemistry
