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Publications by Ken-ichi OHGUCHI
Effect of Creep Deformation on Stress Relaxation During Brazing Process for Electrical Ceramics-Metal Joint
Yosetsu Gakkai Ronbunshu/Quarterly Journal of the Japan Welding Society
Mechanics of Materials
Surfaces
Alloys
Mechanical Engineering
Metals
Films
Coatings
Prediction of Fatigue Failure of 60Sn-40Pb Solder Using Constitutive Model for Cyclic Viscoplasticity.
Transactions of the Japan Society of Mechanical Engineers Series A
Related publications
Stress Relaxation During Hot Deformation of Austenite.
Transactions of the Iron and Steel Institute of Japan
Analysis of Deformation Behavior of Bolted Joint During Fastening Process
TRANSACTIONS OF THE JAPAN SOCIETY OF MECHANICAL ENGINEERS Series C
The Effect of Structural Deformation of Metal Space Frame Radome on Electrical Performance
Bonding Mechanism and Microstructure of Bonded Zone of AlN Ceramics With Ti-AgCu Brazing Metal.
Yosetsu Gakkai Ronbunshu/Quarterly Journal of the Japan Welding Society
Mechanics of Materials
Surfaces
Alloys
Mechanical Engineering
Metals
Films
Coatings
Effect of SiO2 Addition on Electrical Properties of BaTiO3 Ceramics
Journal of the Ceramic Society of Japan
Process-Induced Stress and Deformation of Variable-Stiffness Composite Cylinders During Curing
Materials
Materials Science
Condensed Matter Physics
The Effect of Multiaxial Stress State on Formation of Rafts in CMSX-4 Superalloy During Creep
Advanced Materials Research
Effect of Stress Reduction on Secondary Creep of Mild Steel
Transactions of the Japan Society of Mechanical Engineers
Deformation and Fracture Mode During Small Punch Creep Tests
Transactions of the Japan Society of Mechanical Engineers Series A
