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Publications by Kensuke AKAMATSU

Formation of ULSI Interconnection by Copper Electrodeposition Process Using the Pre-Adsorption of Polyethylene Glycol Derivative

Journal of The Surface Finishing Society of Japan
2007English

Electrodeposition of Sn-0.7Cu-0.3Ag Ternary Alloy From Methanesulfonate Bath for Pb-Free Soldering.

Journal of Japan Institute of Electronics Packaging
Electronic EngineeringElectrical
2002English

A Study on Strength and Failure of Induction-Hardened Chromium-Molybdenum Steel Spur Gears

Bulletin of the JSME
Engineering
1979English

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