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Publications by Kenta Hayashi
Evaluation of Thermal Shock Characteristic and Wettability of Melt Pb-Free Solder About Al2O3/Fe Composites
Nippon Kinzoku Gakkaishi/Journal of the Japan Institute of Metals
Mechanics of Materials
Alloys
Materials Chemistry
Condensed Matter Physics
Metals
Related publications
Wettability of Solder.
HYBRIDS
Development of Pb-Free Solder Distributed Conductive Plastics.
Journal of Japan Institute of Electronics Packaging
Electronic Engineering
Electrical
Coupled Microstructural and Calorimetric Investigation of Controlled Solder Joint Microstructures in Pb-Free Solder
Microscopy and Microanalysis
Instrumentation
The Review of Mounting Technology With Pb-Free Solder.
Journal of SHM
Structure and Kinetics of Sn Whisker Growth on Pb-Free Solder Finish
Thermal Fatigue Life Evaluation of Lead-Free Solder Joint of Chip Size Package With Underfill
Nippon Kinzoku Gakkaishi/Journal of the Japan Institute of Metals
Mechanics of Materials
Alloys
Materials Chemistry
Condensed Matter Physics
Metals
Coarsening of the Sn-Pb Solder Microstructure in Constitutive Model-Based Predictions of Solder Joint Thermal Mechanical Fatigue
Journal of Electronic Materials
Electronic Engineering
Condensed Matter Physics
Optical
Materials Chemistry
Electrical
Magnetic Materials
Electronic
Pb-Free High Temperature Solder Joints for Power Semiconductor Devices
Transactions of The Japan Institute of Electronics Packaging
Effect of Trace Ge on Wettability and High-Temperature Oxidation Resistance of Sn-0.7Cu Lead-Free Solder
Materials Transactions
Mechanics of Materials
Materials Science
Condensed Matter Physics
Mechanical Engineering
