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Publications by Kenzo HATADA
Special Articles: The Future View and Expected Assignments on Printed Circuit Boards. Future of Electric Components.
Circuit Technology
Related publications
Special Issue/Recent Trend and Future of Surface Finishing for Printed Wiring Boards Reviews. The Present and Future View on Printed Wiring Boards.
Journal of the Surface Finishing Society of Japan
Determining Metal Content in Waste Printed Circuit Boards and Their Electronic Components
Journal of Sustainable Development of Energy, Water and Environment Systems
Environmental Science
Renewable Energy
Energy Engineering
Sustainability
Water Science
Power Technology
Technology
the Environment
Recent Progress of High Density Multi-Layer Printed Circuit Boards and the Discussions Towards the Future.Basic Consideration on the Multi-Layer Printed Circuit Boards From the View Point of Electronic Design.
Circuit Technology
Ecology Treatment of Printed Circuit Boards
Acta Mechanica Slovaca
High-Speed Micro Drilling on Printed Circuit Boards
Seimitsu Kogaku Kaishi/Journal of the Japan Society for Precision Engineering
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A Study of Current Distributions on the Printed Circuit Boards
IEEJ Transactions on Fundamentals and Materials
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Recent Progress of High Density Multi-Layer Printed Circuit Boards and the Discussions Towards the Future. Utilization of Multi-Layer Printed Circuit Boards in Advanced Applications. Low Dielectric Constant High Density Multilayer Printed Wiring Board for Large Scale Computer.
Circuit Technology
Special Issue/Recent Trend and Future of Surface Finishing for Printed Wiring Boards Reviews. Tin-Lead Plating Technology for Printed Wiring Board.
Journal of the Surface Finishing Society of Japan
On the Prevention of Electrochemical Migration in Printed Circuit Boards of Avionics
ELECTRONICS: Science, Technology, Business
