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Publications by Kishichi Sasaki
Study on Flux and Alloy of Lead Free Solder With Mitigation Effect and Consideration for Acceleration Test Method
Journal of Japan Institute of Electronics Packaging
Electronic Engineering
Electrical
Related publications
Lead-Free Solder Paste and VOC-Free Solder Paste.
Journal of SHM
Effect of Grain Boundary Misorientation on Electromigration in Lead-Free Solder Joints
Journal of Electronic Materials
Electronic Engineering
Condensed Matter Physics
Optical
Materials Chemistry
Electrical
Magnetic Materials
Electronic
Concurrent Electromigration and Creep in Lead-Free Solder
Journal of Applied Physics
Astronomy
Physics
Effect of Iron Plating Conditions on Reaction in Molten Lead-Free Solder
Materials Transactions
Mechanics of Materials
Materials Science
Condensed Matter Physics
Mechanical Engineering
Cu Corrosion Test Method for Lead-Free Solders
Journal of Welding and Joining
Fatigue Characteristics of Lead-Free Solder Alloys.
Materia Japan
Recent Situation of Lead-Free Solder Technology
Yosetsu Gakkai Shi/Journal of the Japan Welding Society
Mechanics of Materials
Surfaces
Alloys
Mechanical Engineering
Metals
Films
Coatings
Effect of Trace Ge on Wettability and High-Temperature Oxidation Resistance of Sn-0.7Cu Lead-Free Solder
Materials Transactions
Mechanics of Materials
Materials Science
Condensed Matter Physics
Mechanical Engineering
Mechanical Properties and Microstructure of Tin-Silver-Bismuth Lead-Free Solder
Materials Transactions
Mechanics of Materials
Materials Science
Condensed Matter Physics
Mechanical Engineering
