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Publications by Kiyoshi AKAMATSU
Mirror Polishing of Silicon Wafers (4th Report)
Seimitsu Kogaku Kaishi/Journal of the Japan Society for Precision Engineering
Mechanical Engineering
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Grinding and Abrasion-Part II. Chemical Mechanical Polishing of Silicon Wafers.
SHINKU
A Study of Polishing of Silicon Wafers and Processing by an AFM Using Tetra-Mechyl-Ammonium-Hydroxide(TMAH).
Seimitsu Kogaku Kaishi/Journal of the Japan Society for Precision Engineering
Mechanical Engineering
Monocrystalline Silicon Carbide Wafers Processing
Mordovia University Bulletin
Surface Grafting of Polypyrrole Onto Silicon Wafers
Chemistry Letters
Chemistry
A Novel Approach of Chemical Mechanical Polishing for Cadmium Zinc Telluride Wafers
Scientific Reports
Multidisciplinary
Mo Contamination Inp/P+Epitaxial Silicon Wafers
Japanese Journal of Applied Physics, Part 1: Regular Papers & Short Notes
Engineering
Astronomy
Physics
Effect of Ultrasonic Strain on P-Type Silicon Wafers
Japanese Journal of Applied Physics, Part 1: Regular Papers & Short Notes
Engineering
Astronomy
Physics
Surface Damage Effects in Ultrasonic Cleaning of Silicon Wafers
Comparison Between Different Ways in Making Silicon Dioxide Layer on Silicon Wafers
MATEC Web of Conferences
Materials Science
Engineering
Chemistry