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Publications by Kiyoshi Miyake

Improvement of Ta Barrier Film Properties in Cu Interconnection by Using a Non-Mass Separated Ion Beam Deposition Method

Materials Transactions

Mechanics of Materials

Materials Science

Condensed Matter Physics

Mechanical Engineering

English

Warpage Analysis in LCD Panel Under Moisture Diffusion and Hygroscopic Swelling

Journal of Japan Institute of Electronics Packaging

Electronic Engineering

English