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Publications by Koichi TOZAWA
Precision Engineering and Die & Mold Technology. Key Technology for High-Speed, High-Accurate and High-Efficient Manufacturing of Die and Mold.
Seimitsu Kogaku Kaishi/Journal of the Japan Society for Precision Engineering
Mechanical Engineering
Related publications
Development of System for High Accuracy Machining of Die and Mold
Seimitsu Kogaku Kaishi/Journal of the Japan Society for Precision Engineering
Mechanical Engineering
The Special Committee for Die and Mold and Model Technology
Seimitsu Kogaku Kaishi/Journal of the Japan Society for Precision Engineering
Mechanical Engineering
High Speed/High Frequency Technology and EMC. EMC for High-Speed/High-Frequency Communications. High Speed Technology and EMC in Satellite Communication.
The Journal of Japan Institute for Interconnecting and Packaging Electronic Circuits
Designing and Manufacturing of Shaping Parts of a Die Mold
Theoretical & Applied Science
High Speed/High Frequency Technology and EMC. EMC for High-Speed/High-Frequency Communications. EMC Technology for Mobile Communications.
The Journal of Japan Institute for Interconnecting and Packaging Electronic Circuits
CAD/CAM System for Mold and Die.
Seimitsu Kogaku Kaishi/Journal of the Japan Society for Precision Engineering
Mechanical Engineering
Laser Tabbed Die: A Repairable, High-Speed Die-Interconnection Technology. 1994 LDRD Final Report 93-Sr-089
High Value Manufacturing as the Next Frontier of Nano-Precision Mechanical Manufacturing Technology
Seimitsu Kogaku Kaishi/Journal of the Japan Society for Precision Engineering
Mechanical Engineering
High Speed/High Frequency Technology and EMC. Microwave/Millimeter-Wave Photonics.
The Journal of Japan Institute for Interconnecting and Packaging Electronic Circuits
