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Publications by Koji OSHIGE
Analysis of Deformation Process in Ball Bonding in LSI Packaging. Analysis of the Non Steady-State Metal Flow by Physical Simulation.
Transactions of the Japan Society of Mechanical Engineers Series A
Analysis of Deformation Process in Ball Bonding in LSI Packaging.(Analysis of Non-Steady-State Metal Flow by Physical Simulation).
JSME International Journal Series A
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Visualization of Numerical Analysis Process Dy Excel Proceedings - Steady-State Analysis Using a Nonuniform Grid -
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Compensation of Springback Deformation in Sheet Metal Forming Analysis
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