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Publications by Kristin De Meyer
Electrical Modeling and Characterization of Through Silicon via for Three-Dimensional ICs
IEEE Transactions on Electron Devices
Electronic Engineering
Optical
Electrical
Magnetic Materials
Electronic
Related publications
A Fast Simulation Framework for Full-Chip Thermo-Mechanical Stress and Reliability Analysis of Through-Silicon-Via Based 3D ICs
Electrical Transient Modeling for Appliance Characterization
Eurasip Journal on Advances in Signal Processing
Hardware
Electronic Engineering
Signal Processing
Electrical
Architecture
Three-Dimensional Hydro-Environment Characterization and Modeling of the Northern Arabian Gulf
Coastal Engineering Proceedings
Gis and Three-Dimensional Modeling for Cultural Heritages
International Journal of Engineering and Geosciences
Mechanical, Geometrical, and Electrical Characterization of Silicon Membranes for Open Stencil Masks
Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures
Three-Dimensional Printing of a LiFePO4/Graphite Battery Cell via Fused Deposition Modeling
Scientific Reports
Multidisciplinary
Forecasting Landslides via Three-Dimensional Discrete Element Modeling: Helong Landslide Case Study
Applied Sciences (Switzerland)
Instrumentation
Materials Science
Fluid Flow
Engineering
Computer Science Applications
Process Chemistry
Transfer Processes
Technology
Three-Dimensional Modeling From Two-Dimensional Video
IEEE Transactions on Image Processing
Computer Graphics
Computer-Aided Design
Software
Three-Dimensional Modeling of Ovarian Cancer
Advanced Drug Delivery Reviews
Pharmaceutical Science
