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Publications by Kunihiko EGAWA
Greenhouse Gas Emission Calculation Model of Printed Circuit Board and Main Circuit Devices for Power and Industry System
Journal of Life Cycle Assessment, Japan
Explanation of the Growth Mechanism on Bridging of Nb3Sn Superconducting Filaments by Internal-Tin Diffusion Process.
TEION KOGAKU (Journal of Cryogenics and Superconductivity Society of Japan)
Low Resistivity Contacts to Superconducting Oxide Using Ag2O Powder.
TEION KOGAKU (Journal of Cryogenics and Superconductivity Society of Japan)
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AIP Conference Proceedings
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