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Publications by Kunio HAYASHI
Thermal Conductivity Measurement of High Conductivity Refractories by Hot Wire Method
Journal of the Ceramic Association, Japan
Fracture Toughness of Single Crystal Silicon.
Zairyo/Journal of the Society of Materials Science, Japan
Mechanics of Materials
Materials Science
Condensed Matter Physics
Mechanical Engineering
Related publications
Measurement of the Thermal Conductivity of Nanofluids by the Multicurrent Hot-Wire Method
Journal of Applied Physics
Astronomy
Physics
Thermal Conductivity Calibration for Hot Wire Based Dc Scanning Thermal Microscopy
Review of Scientific Instruments
Medicine
Instrumentation
Thermal Conductivity Measurement of Molten Salts by the Transient Hot-Wire Method (1st Report, Construction of Probe and Preliminary Measurement of Molten KNO3)
Nihon Kikai Gakkai Ronbunshu, B Hen/Transactions of the Japan Society of Mechanical Engineers, Part B
Condensed Matter Physics
Mechanical Engineering
On the Measurement of Thermal Conductivity by Cylinder Method
Transactions of the Society of Mechanical Engineers
Simultaneous Estimation of Thermal Conductivity and Diffusivity by Periodic Heating of Hot Wire.
Kagaku Kogaku Ronbunshu
Chemistry
Chemical Engineering
An Improved Model for the Parallel Hot Wire: Application to Thermal Conductivity Measurement of Low Density Insulating Materials at High Temperature
International Journal of Thermal Sciences
Engineering
Condensed Matter Physics
Thermal Conductivity Measurements of Liquids With Transient Hot-Bridge Method
Instrumentation Mesure Metrologie
Instrumentation
Engineering
Measurement of Thermal Conductivity and Diffusivity by Means of Scanning Temperature Method
Journal of Nuclear Science and Technology
High Energy Physics
Nuclear
Engineering
Nuclear Energy
Thermal Conductivity Measurement at Low Temperatures
TEION KOGAKU (Journal of Cryogenics and Superconductivity Society of Japan)