Discover open access scientific publications

Search, annotate, share and cite publications

Publications by Lian-feng REN

Creep Behavior of Annealed Lead-Free Solder for High-Power Electronic Device

DEStech Transactions on Engineering and Technology Research

English

Related publications

Concurrent Electromigration and Creep in Lead-Free Solder

Journal of Applied Physics

English

Lead-Free Solder Paste and VOC-Free Solder Paste.

English

Creep Damage Study at Powercycling of Lead-Free Surface Mount Device

Computational Materials Science

Mechanics of Materials

Materials Science

Computer Science

Computational Mathematics

English

Pb-Free High Temperature Solder Joints for Power Semiconductor Devices

Transactions of The Japan Institute of Electronics Packaging

English

Fatigue Characteristics of Lead-Free Solder Alloys.

English

Recent Situation of Lead-Free Solder Technology

Yosetsu Gakkai Shi/Journal of the Japan Welding Society

Mechanics of Materials

Mechanical Engineering

English

Mechanical Characterization of Lead-Free Sn-Ag-Cu Solder Joints by High-Temperature Nanoindentation

Journal of Electronic Materials

Electronic Engineering

Condensed Matter Physics

Materials Chemistry

Magnetic Materials

English

Creep and Creep Rupture of Sn-95Pb Solder.

Transactions of the Japan Society of Mechanical Engineers Series A

English

Thermodynamic Analysis and Characterization of Bi–Cu–Sn Alloys as Advanced Lead-Free Solder Materials for High Temperature Application

Journal of Materials Science: Materials in Electronics

Electronic Engineering

Biomedical Engineering

Condensed Matter Physics

Molecular Physics,

Magnetic Materials

English