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Publications by Lipu Huang
The Computer Heat Simulation of LED Package
DEStech Transactions on Materials Science and Engineering
Related publications
Numerical Simulation of Heat and Mass Transfer Processes in Microchannels Using CFD-package Flow
Computer Research and Modeling
Computational Theory
Simulation
Computer Science Applications
Modeling
Mathematics
LED and Phototransistor Simulation
Design of the Austempering Heat Treatment of a Ductile Iron Differential Case Aided by Computer Simulation
Latin American Journal of Solids and Structures
Mechanics of Materials
Materials Science
Mechanical Engineering
Automotive Engineering
Ocean Engineering
Structural Engineering
Civil
Aerospace Engineering
Thermal Simulation for Multichip Package.
HYBRIDS
Numerical Simulation of Stratified Flows usingOpenFOAM Package
Proceedings of the Institute for System Programming of RAS
Condensation Simulation for ECU Package
Effect of Multiple Reflows on the Mechanical Reliability of Solder Joint in LED Package
Journal of Korean Institute of Metals and Materials
Surfaces
Alloys
Metals
Simulation
Optical
Magnetic Materials
Films
Modeling
Coatings
Electronic
Computer Simulation of Liquids.
Mathematics of Computation
Computational Mathematics
Applied Mathematics
Number Theory
Algebra
Computer Simulation of Solidification
